Ceramic COB LED Packaging Technology
The LED packaging method is to connect the chip (Die) with its heat dissipation substrate Submount (submount technology) by wire bonding, eutectic or flip chip packaging technology to form an LED ...
The LED packaging method is to connect the chip (Die) with its heat dissipation substrate Submount (submount technology) by wire bonding, eutectic or flip chip packaging technology to form an LED ...
LED packaging is to connect the outer leads to the electrodes of the LED chip to facilitate connection with other devices. It not only connects the electrodes on the chip to the package shell with ...